News

News, guides and technical insights on electrostatic chucks (ESCs), ESC repair and semiconductor fab equipment from the ESC Technology team.

LATEST NEWS

Coefficient of Thermal Expansion & Wafer Matching in ESCs

October 9, 2026

Why electrostatic chuck CTE and wafer matching matter: alumina, AlN and silicon expansion, differential stress, particles and thermal uniformity.

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Electrostatic Chucks (ESCs): The Complete Engineering Guide

What an electrostatic chuck (ESC) is, how Coulombic and Johnsen–Rahbek clamping work, ESC materials, wafer sizes, helium backside cooling, dechucking, and repair vs replacement.

SUPER-DENSE CERAMIC ESC MATERIAL NOW AVAILABLE!

The latest developments in 300mm. ESC are now becoming available for 200mm and 150mm, in the expanded products from ESCT. Using a proprietary patented process at TEMNEST, the latest Alumina material offers even higher dielectric constant performance.

ESC TECHNOLOGY EXPANDS WITH NEW OFFICE

As part of our expansion we have moved to new premises. We have new offices which will allow us to continue to grow our business and engineering capabilities.

Welcome to ESCT

We deliver new improved ESC technology for Plasma Etch and HDPCVD chambers. Our products mean reduced cost of ownership and improved process performance.