Since 2020, ESC Technology Ltd has used distribution companies to support to our ESC customers in the United States. Effective April 1st, 2025, we will operate a direct supply and support model through our USA subsidiary, ESC Technology Inc. This will enhance our ability to provide our USA customers with closer technical collaboration with Temnest (OEM).
Any questions please contact our USA Business Manager Dawn Bellemare at dawn@esctech.com
Why electrostatic chuck CTE and wafer matching matter: alumina, AlN and silicon expansion, differential stress, particles and thermal uniformity.
How electrostatic chuck volume resistivity sets the Coulombic or Johnsen-Rahbek clamping regime, the resistivity bands, and why it matters in the fab.
Ceramic vs polymer electrostatic chucks compared on plasma resistance, thermal tolerance and durability, and where each type is actually used.
How titania-doped alumina tunes electrostatic chuck resistivity into the Johnsen-Rahbek band for higher clamping force per volt, and the trade-offs involved.
Aluminum nitride (AlN) electrostatic chucks: high thermal conductivity, CTE close to silicon, JR clamping and where the cost premium over alumina pays off.
