Ceramic ESC Lift Pins for the following OEM P/N;
(0010-23726 DPS + Ceramic) & (0010-36202 DPS Polyimide Equivalent)
2nd Source New, qualified in major FABs.
ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.
Why electrostatic chuck CTE and wafer matching matter: alumina, AlN and silicon expansion, differential stress, particles and thermal uniformity.
How electrostatic chuck volume resistivity sets the Coulombic or Johnsen-Rahbek clamping regime, the resistivity bands, and why it matters in the fab.
Ceramic vs polymer electrostatic chucks compared on plasma resistance, thermal tolerance and durability, and where each type is actually used.
How titania-doped alumina tunes electrostatic chuck resistivity into the Johnsen-Rahbek band for higher clamping force per volt, and the trade-offs involved.
Aluminum nitride (AlN) electrostatic chucks: high thermal conductivity, CTE close to silicon, JR clamping and where the cost premium over alumina pays off.
