The TM105408 is a direct-equivalent ESC for the Applied Materials DPS poly and metal etch chambers, supplied by ESC Technology as a drop-in replacement for OEM part numbers 0090-35133, 0040-77771, 0020-39087 and 0041-33399. It installs onto the existing OEM cathode and runs with the same process kits, settings and voltages, so it qualifies into a production chamber without a recipe change.
What the ESC does, and why its condition matters
In a DPS etch chamber the ESC clamps the wafer flat against the cathode and holds its temperature through the process. Both functions feed straight into process results: uneven or drifting clamping force changes thermal contact across the wafer, and lost temperature uniformity drives etch-rate and profile variation. Because the DPS platform is used for both poly and metal etch, the ESC has to hold that performance across demanding chemistries, so its condition sets the ceiling on uniformity, particle performance and yield, and a degraded ESC caps the chamber long before it is formally failed.
Why engineers replace the OEM DPS ESC
The OEM DPS ESC is a polyimide design. As the polyimide ages under plasma exposure and thermal cycling, clamping force drifts, temperature uniformity is lost, particle counts climb and dechucking becomes unreliable, the failure pattern that pulls a DPS chamber out of spec and forces an ESC replacement. The drift is gradual, so the chamber often produces marginal wafers before the ESC is changed; a more stable replacement protects yield as well as ESC life.
The coulombic ceramic difference
The TM105408 replaces the polyimide ESC with an improved coulombic ceramic design. Better design and material give better etch and temperature uniformity and improved particle performance, with clamping that stays consistent across the ESC’s life rather than drifting as polyimide does. The chamber holds its process window for longer across both poly and metal etch and spends more of its time producing in-specification wafers.
Material
An improved ceramic body in place of the OEM polyimide construction, underpinning the more stable clamping and thermal behaviour.
Process and particle performance
A waferless plasma clean can be performed with this ESC, letting the chamber be cleaned and kept stable between wafers without a dummy wafer. With more uniform clamping and improved thermal contact, both poly and metal etch uniformity and particle performance improve, and stay stable over a longer service interval, fewer process-drift investigations and fewer ESC-related particle excursions.
Drop-in compatibility and qualification
- Fits the existing OEM cathode: no hardware modification.
- Uses the same OEM process kits.
- Runs the same ESC settings and voltages.
Because nothing in the surrounding chamber changes, qualification is straightforward and the ESC can be brought into production quickly.
Sizes
Available for 150mm and 200mm wafer processing.
Repairable to new: lower cost of ownership
Built to be reconditioned to original specification rather than scrapped. Level 1 (surface recondition, ~25% of new) and Level 2 (full rebuild, ~70%) repair routes are available, up to three times per ESC, materially reducing lifetime cost of ownership versus repeated OEM purchases and turning each ESC into a reusable asset. (Repair pricing is indicative and quoted per ESC after inspection.)
Why source the equivalent from ESC Technology
Consistent build quality, a clear “direct equivalent, not an OEM part” position, and the repair programme above, supported across North America, Europe, South-East Asia and Japan.
One equivalent for both DPS poly and metal etch
A practical advantage of the TM105408 is that a single equivalent covers both the DPS poly and DPS metal etch chambers, which simplifies spares holding for a fab that runs both. Rather than stocking and qualifying separate ESCs per process, maintenance teams can standardise on one part across the DPS install base, reducing the number of distinct line items to manage and making the repair-and-rotate model easier to run. The ESC still has to satisfy two demanding processes: poly etch’s sensitivity to temperature uniformity and critical-dimension control, and metal etch’s intolerance of particles and residues. The coulombic ceramic design serves both because it removes the common failure mode (clamping force drifting with an ageing surface) that undermines temperature uniformity and generates particles on the OEM polyimide ESC. With clamping held steady across the ESC’s life, both processes keep a stable thermal and particle baseline. Standardising on one repairable equivalent also smooths cost: an ESC pulled from one DPS chamber can be reconditioned and returned to any DPS chamber in the fleet, so the rotation pool serves the whole platform rather than a single tool.
Specifications
| Chamber / platform | Applied Materials DPS (poly & metal etch) |
| ESC Technology part no. | TM105408N |
| Clamping type | Coulombic |
| Replaces | Polyimide OEM ESC |
| Cathode / process kit | Uses existing OEM cathode and process kits |
| Settings / voltages | Same as OEM |
| Waferless plasma clean | Supported |
| Wafer sizes | 150mm, 200mm |
| Repairable | Yes: Level 1 & Level 2, up to 3× |
OEM cross-reference
| OEM (Applied Materials) part no. | ESC Technology equivalent |
| 0090-35133 | TM105408N |
| 0040-77771 | TM105408N |
| 0020-39087 | TM105408N |
| 0041-33399 | TM105408N |
Applied Materials periodically revises part numbers; both superseded and current numbers resolve to this page.
Frequently asked questions
Is the TM105408 a direct drop-in for the AMAT DPS Poly / DPS Metal ESC?
Yes, same OEM cathode, process kits, settings and voltages, so no recipe change is required.
Which OEM part numbers does it replace?
0090-35133, 0040-77771, 0020-39087 and 0041-33399.
Does it serve both poly and metal etch?
Yes, it is the direct equivalent for the DPS poly and DPS metal etch chambers.
How is it different from the OEM ESC?
It replaces the polyimide design with an improved coulombic ceramic ESC for better etch/temperature uniformity and particle performance.
Why does the OEM polyimide ESC drift out of specification?
Polyimide degrades with plasma exposure and thermal cycling, so clamping and temperature uniformity change as it ages.
Can a waferless plasma clean be performed?
Yes.
What wafer sizes are available?
150mm and 200mm.
Can it be repaired, and how many times?
Up to three times, via Level 1 or Level 2 repair (indicatively ~25% and ~70% of new).
Where is it supplied?
North America, Europe, South-East Asia and Japan.
Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.
ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.