The TM105508 is the latest ceramic ESC (CESC) technology for the Applied Materials DPS+ poly etch chamber, supplied by ESC Technology as a direct-equivalent, drop-in replacement for OEM part numbers 0010-15668 and 0010-93181. It uses the same OEM cathode and process kit, and can be repaired to new condition multiple times.
What the ESC does, and why its condition matters
In the DPS+ poly etch chamber the ESC clamps the wafer flat against the cathode and holds its temperature through the process. Clamping stability and thermal uniformity drive etch uniformity and particle performance, so the ESC’s condition sets the ceiling on what the chamber can achieve. An ESC whose clamping or surface condition has drifted does not just risk a hard failure. It first erodes uniformity and particle performance, capping yield quietly.
Why engineers replace the OEM DPS+ Poly ESC
The original DPS+ ESC is an aluminium-nitride (AlN) plate. As an AlN ESC ages, its clamping behaviour and surface condition change, bringing wafer sticking, unreliable dechucking, particle excursions and loss of temperature uniformity, the usual reasons a DPS+ poly ESC is pulled and replaced. Because the cause is surface-condition drift, the symptoms tend to worsen progressively.
The coulombic CESC difference
The TM105508 replaces the OEM AlN ESC with ESC Technology’s latest CESC (ceramic ESC) technology and an improved coulombic design. The improved design and better material mean no sticking and a much longer lifetime: clamping stays consistent and dechucking remains clean as the ESC ages, rather than drifting with surface condition. The chamber therefore keeps a stable clamping and thermal baseline across the ESC’s life instead of chasing a moving target.
Material
ESC Technology’s improved ceramic material in place of the OEM AlN plate, which is what removes the surface-condition dependence and extends life.
Process and particle performance
More consistent clamping and improved thermal contact give steadier DPS+ poly etch results and better particle performance, held over a longer service interval than the OEM AlN ESC, fewer dechuck faults and fewer ESC-related particle excursions.
Drop-in compatibility and qualification
- Fits the existing OEM cathode: no hardware modification.
- Uses the same OEM process kit.
Sizes
Available for 150mm and 200mm wafer processing.
Repairable to new: lower cost of ownership
The TM105508 can be repaired to new condition multiple times rather than scrapped. Level 1 (surface recondition, ~25% of new) and Level 2 (full rebuild, ~70%) repair routes are available, up to three times per ESC, substantially reducing lifetime cost of ownership and turning each ESC into a reusable asset rather than a single-use spare. (Repair pricing is indicative and quoted per ESC after inspection.)
Why source the equivalent from ESC Technology
Consistent build quality, a clear “direct equivalent, not an OEM part” position, and the repair programme above, supported across North America, Europe, South-East Asia and Japan.
From AlN to CESC ceramic
The move from the OEM aluminium-nitride (AlN) ESC to ESC Technology’s CESC ceramic design is the central change on this page, and it is worth being clear about what it fixes. An AlN ESC in the DPS+ poly chamber clamps in a way that is tied to the condition of its surface; as that surface is conditioned by the plasma over thousands of wafers, clamping behaviour and dechucking reliability move with it, which is why an ageing AlN ESC starts to stick and dechuck inconsistently. The CESC coulombic design decouples clamping from surface condition, so the ESC behaves consistently from new through to the point it is due for reconditioning: no progressive sticking, no creeping dechuck failures, and a longer usable life between repairs. For the DPS+ poly process specifically, that stability protects temperature uniformity and critical-dimension control across the ESC’s life rather than only when the ESC is fresh. And because the CESC ESC uses the existing OEM cathode and process kit, the upgrade is a drop-in: the chamber gains the more stable clamping behaviour without a hardware change or a fresh process characterisation.
Specifications
| Chamber / platform | Applied Materials DPS+ (poly etch) |
| ESC Technology part no. | TM105508N |
| Technology | Latest CESC, coulombic |
| Replaces | AlN OEM ESC |
| Cathode / process kit | Uses existing OEM cathode and process kit |
| Wafer sizes | 150mm, 200mm |
| Repairable | Yes: to new condition, multiple times (L1 & L2) |
OEM cross-reference
| OEM (Applied Materials) part no. | ESC Technology equivalent |
| 0010-15668 | TM105508N |
| 0010-93181 | TM105508N |
Applied Materials periodically revises part numbers; superseded and current numbers resolve to this page.
Frequently asked questions
Is the TM105508 a direct drop-in for the AMAT DPS+ Poly ESC?
Yes, it uses the same OEM cathode and process kit, replacing OEM 0010-15668 and 0010-93181.
How is it different from the OEM DPS+ ESC?
The OEM ESC is an AlN plate; the TM105508 is the latest CESC coulombic ceramic ESC, which means no sticking and a much longer lifetime.
Why does the OEM AlN ESC develop sticking and dechucking problems?
Because the clamping behaviour of an AlN ESC changes with surface condition as it ages.
Which OEM part numbers does it replace?
0010-15668 and 0010-93181.
What wafer sizes are available?
150mm and 200mm.
Can it be repaired, and how many times?
Yes, to new condition, up to three times, via Level 1 or Level 2 repair (indicatively ~25% and ~70% of new).
Does it serve metal etch as well as poly?
This page is the DPS+ poly equivalent; for DPS+ metal etch see the TM105608N.
Where is it supplied?
North America, Europe, South-East Asia and Japan.
Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.
ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.