The TM105808 is a direct-equivalent ESC for the Applied Materials eMAX etch chamber, supplied by ESC Technology as a drop-in replacement for OEM part numbers 0010-05995 and 0040-40980. It is a coulombic design that delivers better cost of ownership and improved process performance in place of the original ESC.
What the ESC does, and why its condition matters
In the eMAX etch chamber the ESC clamps the wafer to the cathode and holds its temperature through the process. Clamping stability and thermal uniformity drive etch uniformity and yield, so the ESC’s condition has a direct effect on the cost and quality of every wafer the chamber runs. An ESC that no longer clamps consistently or dechucks cleanly does not just fail outright. It first erodes uniformity and particle performance, quietly capping what the chamber can produce.
Why engineers replace the OEM eMAX ESC
The original eMAX ESC is an aluminium-nitride (AlN) plate that clamps using the Johnsen-Rahbek (JR) effect. JR clamping depends on a small leakage current across the contact between the ESC surface and the wafer, which means the clamping force depends on the surface condition of the plate. As the plate ages and its surface changes, that force drifts, bringing wafer sticking, inconsistent or failed dechucking, particle excursions and loss of temperature uniformity. These are the usual reasons an eMAX ESC is pulled and replaced, and because the cause is surface-condition drift, the problems tend to worsen progressively rather than appear all at once.
The coulombic difference
The TM105808 replaces the AlN JR plate with a coulombic ESC. A coulombic ESC clamps through direct electrostatic attraction rather than the Johnsen-Rahbek leakage mechanism, so clamping force does not depend on the plate’s surface condition. That single change removes the sticking and dechucking problems that develop on an ageing JR ESC: the clamp behaves consistently from the first wafer to the last, and dechucking is clean and repeatable. The chamber therefore keeps a stable clamping and thermal baseline across the ESC’s life instead of chasing a moving target as the OEM plate ages.
Material
ESC Technology builds the coulombic ESC from an improved ceramic body in place of the OEM AlN plate, which is what removes the surface-condition dependence of the JR design.
Process and particle performance
More consistent clamping and improved thermal contact give steadier etch results and better particle performance than a worn OEM ESC, and hold that performance over a longer service interval. For the chamber owner that means fewer dechuck faults, fewer particle excursions traced to the ESC, and a more predictable process window.
Drop-in compatibility and qualification
The TM105808 is designed to qualify into the existing eMAX chamber with minimal change, using the existing cathode and process hardware so that qualification does not require a recipe redevelopment.
Sizes
Available for 150mm and 200mm wafer processing.
Repairable to new: lower cost of ownership
Unlike the OEM ESC, the TM105808 is built to be reconditioned to original specification rather than scrapped. Level 1 (surface recondition, ~25% of new) and Level 2 (full rebuild, ~70%) repair routes are available, up to three times per ESC. Over the life of an eMAX chamber that repairability replaces a string of new-ESC purchases with low-cost reconditioning of the same equivalent ESC, which is what “reduce cost of ownership” means in practice. (Repair pricing is indicative and quoted per ESC after inspection.)
Why source the equivalent from ESC Technology
Consistent build quality, a clear “direct equivalent, not an OEM part” position, and the repair programme above, supported across North America, Europe, South-East Asia and Japan.
Planning the changeover
Switching the eMAX chamber to the TM105808 equivalent is designed to be low-risk. Because the ESC is coulombic rather than Johnsen-Rahbek, the most common changeover question (whether the clamping recipe needs re-tuning) is largely removed: coulombic clamping is set by applied voltage rather than by the surface condition of an ageing plate, so behaviour is predictable from the first wafer. A typical changeover is to install the equivalent during a scheduled preventive-maintenance window, confirm clamping and dechucking on a short qualification lot, and release the chamber back to production. Many fabs keep one reconditioned ESC in rotation so a tired ESC can be pulled and sent for Level 1 or Level 2 repair while the spare runs, eliminating the wait for a new OEM ESC and smoothing cost across the year. Because the equivalent uses the existing cathode and chamber hardware, there is no mechanical rework to schedule and no long re-qualification: the work is an ESC swap and a confidence check, not a chamber rebuild. For engineers tracking ESC health, the coulombic design also makes degradation easier to read: clamping force does not quietly drift with surface condition, so the ESC holds a stable baseline until it is genuinely due for reconditioning.
Specifications
| Chamber / platform | Applied Materials eMAX (etch) |
| ESC Technology part no. | TM105808F |
| Clamping type | Coulombic |
| Replaces | AlN, JR-type OEM ESC |
| Wafer sizes | 150mm, 200mm |
| Repairable | Yes: Level 1 & Level 2, up to 3× |
OEM cross-reference
| OEM (Applied Materials) part no. | ESC Technology equivalent |
| 0010-05995 | TM105808F |
| 0040-40980 | TM105808F |
Applied Materials periodically revises part numbers; both superseded and current numbers resolve to this page.
Frequently asked questions
Is the TM105808 a direct equivalent for the AMAT eMAX ESC?
Yes, it is a direct-equivalent coulombic ESC for the eMAX chamber, replacing OEM 0010-05995 and 0040-40980.
How is it different from the OEM eMAX ESC?
The OEM ESC is an AlN JR-type plate; the TM105808 is a coulombic ESC, so clamping stays consistent and dechucking remains clean as the ESC ages.
Why does the OEM eMAX ESC develop sticking and dechucking problems?
Because JR clamping force changes with the surface condition of the AlN plate, which degrades over time.
Which OEM part numbers does it replace?
0010-05995 and 0040-40980.
What wafer sizes are available?
150mm and 200mm.
Can it be repaired, and how many times?
Up to three times, via Level 1 or Level 2 repair (indicatively ~25% and ~70% of new).
Do I need to redevelop my recipe to qualify it?
No, it is designed to qualify into the existing chamber using the existing hardware.
Where is it supplied?
North America, Europe, South-East Asia and Japan.
Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.
ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.