The TM207108 is a direct-equivalent ESC for the Lam Research Exelan 4520 etch platform, supplied by ESC Technology as a drop-in replacement for OEM part numbers 839-440462-508 and 839-440462-108. It uses the same OEM power supply and process kits, so it qualifies into a production chamber without changing the surrounding hardware.
What the ESC does, and why its condition matters
On the Exelan 4520 etch platform the ESC clamps the wafer flat against the cathode and holds its temperature through the process. On this platform, dechucking reliability is as important as clamping: if the wafer does not release cleanly, the chamber depends on perimeter lift pins and longer dechucking recipes, both of which cost throughput and add particle risk. Clamping stability, dechucking behaviour and thermal uniformity together set the ceiling on etch uniformity, throughput and yield, so the ESC’s condition has a direct effect on the cost and quality of every wafer.
Why engineers replace the OEM Exelan ESC
The original Exelan ESC is made from titanium dioxide (TiO2). As it ages, dechucking becomes less reliable and engineers lean on perimeter lift pins and extended dechucking recipes to release the wafer cleanly, which slows the chamber and increases particle risk. Declining clamping and dechucking performance is the usual reason an Exelan ESC is replaced.
The coulombic difference
The TM207108 uses ESC Technology’s latest coulombic design and materials. Coulombic clamping releases the wafer cleanly and reliably, which removes the need for perimeter lift pins and lets the chamber run simplified dechucking recipes, and simpler, faster dechucking can directly improve throughput. Clamping behaviour stays consistent across the ESC’s life rather than degrading as the TiO2 ESC does, so the platform holds its performance for longer.
Material
ESC Technology’s latest coulombic ESC material in place of the OEM TiO2 plate, which is what enables the cleaner dechucking and the removal of perimeter lift pins.
Process and particle performance
Reliable dechucking without perimeter lift pins removes a common source of particles and handling faults, and the simplified recipes that the coulombic design allows help keep throughput high. The combined effect is steadier process performance and fewer dechuck-related interruptions across the life of the ESC.
Drop-in compatibility and qualification
- Uses the same OEM power supply.
- Uses the same OEM process kits.
- Removes the need for perimeter lift pins.
Because the ESC uses the existing power supply and process kits, it qualifies into the chamber without a hardware change, and the simplified dechucking recipe is an upside rather than a re-qualification burden.
Sizes
Available for 150mm and 200mm wafer processing.
Repairable to new: lower cost of ownership
The TM207108 can be repaired to new condition multiple times rather than scrapped, which reduces cost of ownership and maintains process performance. Level 1 (surface recondition, ~25% of new) and Level 2 (full rebuild, ~70%) repair routes are available, up to three times per ESC, so each ESC becomes a reusable asset rather than a single-use spare. (Repair pricing is indicative and quoted per ESC after inspection.)
Why source the equivalent from ESC Technology
A coulombic upgrade that removes perimeter lift pins and can improve throughput, built to consistent quality, backed by the repair programme above, and supported across North America, Europe, South-East Asia and Japan.
The operational impact of removing perimeter lift pins
Removing the need for perimeter lift pins is more than a convenience on the Exelan platform. It changes how the chamber runs day to day. Perimeter lift pins exist on the OEM ESC to help release a wafer that does not dechuck cleanly, and they bring their own costs: they are an additional wear item, they introduce points of contact that can generate particles, and the extended dechucking recipes they rely on slow the chamber down. The coulombic TM207108 dechucks the wafer cleanly on its own, so those perimeter lift pins are no longer needed. That removes a recurring consumable and a particle source, and it lets the chamber run a simplified, shorter dechucking recipe, which can directly improve throughput on a high-utilisation etch tool. The benefit compounds over a campaign: cleaner dechucking means fewer wafers stuck or mishandled at unload, fewer particle excursions traced to the dechuck step, and less time lost to dechuck-related faults. Because the ESC uses the same OEM power supply and process kits, all of this is gained without a hardware change, and the simplified dechucking recipe is an upside to capture during qualification rather than a re-characterisation burden.
Specifications
| Platform | Lam Research Exelan 4520 (etch) |
| ESC Technology part no. | TM207108F |
| Clamping type | Coulombic |
| Replaces | TiO2 OEM ESC |
| Power supply / process kit | Uses existing OEM power supply and process kits |
| Perimeter lift pins | Not required |
| Wafer sizes | 150mm, 200mm |
| Repairable | Yes: Level 1 & Level 2, up to 3× |
OEM cross-reference
| OEM (Lam Research) part no. | ESC Technology equivalent |
| 839-440462-508 | TM207108F |
| 839-440462-108 | TM207108F |
Lam Research part numbers can change over time; superseded and current numbers resolve to this page.
Frequently asked questions
Is the TM207108 a direct drop-in for the LAM Exelan ESC?
Yes, it uses the same OEM power supply and process kits, replacing LAM 839-440462-508 and 839-440462-108.
Do I still need perimeter lift pins?
No. The coulombic design dechucks reliably without perimeter lift pins, and allows simplified dechucking recipes that can improve throughput.
How is it different from the OEM Exelan ESC?
The OEM ESC is a TiO2 plate; the TM207108 uses ESC Technology’s latest coulombic design and materials for cleaner dechucking and better throughput.
Will it improve throughput?
Simplified dechucking recipes, made possible by the coulombic design, can improve throughput versus the OEM ESC’s longer dechucking sequences.
Which OEM part numbers does it replace?
839-440462-508 and 839-440462-108.
What wafer sizes are available?
150mm and 200mm.
Can it be repaired, and how many times?
Yes, to new condition, up to three times, via Level 1 or Level 2 repair (indicatively ~25% and ~70% of new).
Where is it supplied?
North America, Europe, South-East Asia and Japan.
Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.
ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Lam Research. This product is a direct equivalent only. It is not an OEM part.