MkII ESC – Direct Equivalent to 0040-99964

MkII TM105908VN-S ESC, top view MkII TM105908VN-S ESC, bottom view
MkII ESC – Direct Equivalent to 0040-99964

Direct equivalent to P/N – (0040-99964 – 0010-10257 – 0040-09957 – 0040-09797)

 

Our ESC TM105908 replaces polyimide and improves cost of ownership and process performance.

TM105908 uses the same OEM cathode and process kit, and the same ESC settings and voltages. The improved design and better material means better etch and temperature uniformity and improves particle performance. A waferless plasma clean can now be performed.

Now available for 100mm, 150mm and 200mm

OEM P/N

0040-99964 – 0010-10257 – 0040-09957 – 0040-09797

ESCS P/N

N/A

SOURCE

N/A

The TM105908 is a direct-equivalent ESC for the Applied Materials MkII etch chamber, supplied by ESC Technology as a drop-in replacement for OEM part numbers 0040-99964, 0010-10257, 0040-09957 and 0040-09797. It installs onto the existing OEM cathode and runs with the same process kits, settings and voltages, so it qualifies into a production chamber without a recipe change.

What the ESC does, and why its condition matters

In the MkII etch chamber the ESC clamps the wafer flat against the cathode and holds its temperature through the process. Clamping stability and thermal uniformity drive etch uniformity and particle performance, so the ESC’s condition sets the ceiling on yield. A worn ESC quietly caps uniformity and particle performance before it is formally failed, so ESC stability matters as much for steady production as for avoiding hard failures.

Why engineers replace the OEM MkII ESC

The OEM MkII ESC is a polyimide design. As the polyimide ages under plasma exposure and thermal cycling, clamping force drifts, temperature uniformity is lost, particle counts climb and dechucking becomes unreliable, the familiar failure pattern that forces an MkII ESC replacement. Because the drift is gradual, the chamber often runs marginal before the ESC is changed.

The coulombic ceramic difference

The TM105908 replaces the polyimide ESC with an improved coulombic ceramic design. Better design and material give better etch and temperature uniformity and improved particle performance, with clamping that stays consistent across the ESC’s life rather than drifting as polyimide does, so the chamber holds its process window for longer.

Material

An improved ceramic body in place of the OEM polyimide construction, underpinning the more stable clamping and thermal behaviour.

Process and particle performance

A waferless plasma clean can be performed with this ESC, letting the chamber be cleaned and kept stable between wafers without a dummy wafer. With more uniform clamping and improved thermal contact, MkII etch uniformity and particle performance improve and stay stable over a longer service interval.

Drop-in compatibility and qualification

  • Fits the existing OEM cathode: no hardware modification.
  • Uses the same OEM process kits.
  • Runs the same ESC settings and voltages.

Sizes

Available for 100mm, 150mm and 200mm wafer processing.

Repairable to new: lower cost of ownership

Built to be reconditioned to original specification rather than scrapped. Level 1 (~25% of new) and Level 2 (~70%) repair routes are available, up to three times per ESC, materially reducing lifetime cost of ownership versus repeated OEM purchases and turning each ESC into a reusable asset. (Repair pricing is indicative and quoted per ESC after inspection.)

Why source the equivalent from ESC Technology

Consistent build quality, a clear “direct equivalent, not an OEM part” position, and the repair programme above, supported across North America, Europe, South-East Asia and Japan.

Qualifying the MkII equivalent

Qualifying the TM105908 into an MkII chamber is designed to be straightforward, because nothing the process depends on changes. The equivalent uses the existing OEM cathode and process kits and runs the same ESC settings and voltages, so the qualified recipe carries over unchanged: the work is to confirm clamping and dechucking on a short qualification lot and release the chamber, not to re-characterise the process. The coulombic design helps here too: because clamping force is set by applied voltage rather than by the surface condition of an ageing plate, the ESC behaves predictably from the first wafer, and the same clamping settings continue to hold as the ESC accumulates wafers. That predictability is what makes the repair-and-rotate model practical on the MkII platform: a reconditioned ESC returns to service behaving like a new one, so swapping a tired ESC for a freshly repaired spare does not reopen the qualification question each time. Many fabs keep a reconditioned MkII ESC in rotation so an ESC can be pulled for Level 1 or Level 2 repair during a scheduled maintenance window while the spare runs, keeping the chamber available and spreading ESC cost evenly across the year.

Specifications

Chamber / platform Applied Materials MkII (etch)
ESC Technology part no. TM105908VN-S
Clamping type Coulombic
Replaces Polyimide OEM ESC
Cathode / process kit Uses existing OEM cathode and process kits
Settings / voltages Same as OEM
Waferless plasma clean Supported
Wafer sizes 100mm, 150mm, 200mm
Repairable Yes: Level 1 & Level 2, up to 3×

OEM cross-reference

OEM (Applied Materials) part no. ESC Technology equivalent
0040-99964 TM105908VN-S
0010-10257 TM105908VN-S
0040-09957 TM105908VN-S
0040-09797 TM105908VN-S

Applied Materials periodically revises part numbers; both superseded and current numbers resolve to this page.

Frequently asked questions

Is the TM105908 a direct drop-in for the AMAT MkII ESC?

Yes, same OEM cathode, process kits, settings and voltages, so no recipe change is required.

Which OEM part numbers does it replace?

0040-99964, 0010-10257, 0040-09957 and 0040-09797.

How is it different from the OEM ESC?

It replaces the polyimide design with an improved coulombic ceramic ESC for better etch/temperature uniformity and particle performance.

Why does the OEM polyimide ESC drift out of specification?

Polyimide degrades with plasma exposure and thermal cycling, so clamping and temperature uniformity change as it ages.

Can a waferless plasma clean be performed?

Yes.

What wafer sizes are available?

100mm, 150mm and 200mm.

Can it be repaired, and how many times?

Up to three times, via Level 1 or Level 2 repair (indicatively ~25% and ~70% of new).

Do I need to change my process recipe?

No.

Where is it supplied?

North America, Europe, South-East Asia and Japan.

Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.

ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.


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