The TM105308 is a direct-equivalent ESC for the Applied Materials MxP+ metal etch chamber, supplied by ESC Technology as a drop-in replacement for OEM part numbers 0090-35112. It installs onto the existing OEM cathode and runs with the same process kits, settings and voltages, so it qualifies into a production chamber without a recipe change.
What the ESC does, and why its condition matters
In a metal etch chamber the ESC clamps the wafer flat against the cathode and controls its temperature through the process. Metal etch places particular demands on particle performance and temperature uniformity: metal residues and particle defects are unforgiving on yield, and temperature variation across the wafer drives profile and rate variation. The ESC governs both clamping and thermal contact, so its condition directly sets how tightly the chamber can hold its metal-etch process, and a degraded ESC caps performance well before it is formally failed.
Why engineers replace the OEM MxP+ Metal ESC
The OEM ESC is a polyimide design that degrades with plasma exposure and thermal cycling. As it ages it produces drifting clamping force, loss of temperature uniformity, rising particle counts and unreliable dechucking, the failure pattern that pulls a metal etch chamber out of spec. Because the drift is gradual, the chamber often runs marginal before the ESC is changed, so a more stable replacement protects yield as well as extending ESC life.
The coulombic ceramic difference
The TM105308 replaces the polyimide ESC with an improved coulombic ceramic design, delivering better etch and temperature uniformity and improved particle performance, with consistent clamping across the ESC’s service life. The chamber holds its metal-etch window longer and produces more in-specification wafers between interventions.
Material
An improved ceramic body in place of the OEM polyimide construction, underpinning the more stable clamping and thermal behaviour.
Process and particle performance
A waferless plasma clean can be performed, letting the chamber be cleaned and kept stable between wafers without a dummy wafer. With more uniform clamping and improved thermal contact, metal etch uniformity and particle performance improve and remain stable over a longer service interval, fewer particle excursions and fewer process-drift investigations traced to the ESC.
Drop-in compatibility and qualification
- Fits the existing OEM cathode: no hardware modification.
- Uses the same OEM process kits.
- Runs the same ESC settings and voltages.
Sizes
Available for 150mm and 200mm wafer processing.
Repairable to new: lower cost of ownership
Built to be reconditioned rather than scrapped. Level 1 (~25% of new) and Level 2 (~70%) repair routes are available, up to three times per ESC, which materially lowers lifetime cost of ownership versus repeated OEM purchases and turns each ESC into a reusable asset. (Repair pricing is indicative and quoted per ESC after inspection.)
Why source the equivalent from ESC Technology
Consistent build quality, a clear “direct equivalent, not an OEM part” position, and the repair programme above, supported across North America, Europe, South-East Asia and Japan.
Metal etch, particles and ESC condition
Metal etch is among the most particle-sensitive steps an ESC supports, and it is also where a degraded ESC does the most damage. Metallic residues and particle defects are unforgiving on device yield, and any variation in wafer temperature across the ESC changes etch rate and profile in a layer where that variation is costly. The OEM polyimide ESC works against both of these as it ages: clamping force drifts, the wafer is held less flat, thermal contact becomes uneven, and the degrading surface becomes a particle source in its own right. The coulombic ceramic TM105308 addresses the root cause by holding clamping force steady independent of surface ageing, so the wafer stays flat and thermally well-coupled, and the cleaner clamping and dechucking behaviour removes a recurring particle source. For a metal etch chamber the practical payoff is fewer particle excursions traced back to the ESC and a tighter, more stable process window between cleans. Because the equivalent runs the same settings and voltages and uses the existing cathode and process kits, none of this comes at the cost of a re-qualification: the chamber keeps its qualified recipe and simply runs on a more stable ESC.
Specifications
| Chamber / platform | Applied Materials MxP+ (metal etch) |
| ESC Technology part no. | TM105308F |
| Clamping type | Coulombic |
| Replaces | Polyimide OEM ESC |
| Cathode / process kit | Uses existing OEM cathode and process kits |
| Settings / voltages | Same as OEM |
| Waferless plasma clean | Supported |
| Wafer sizes | 150mm, 200mm |
| Repairable | Yes: Level 1 & Level 2, up to 3× |
OEM cross-reference
| OEM (Applied Materials) part no. | ESC Technology equivalent |
| 0090-35112 | TM105308F |
Applied Materials periodically revises part numbers; both superseded and current numbers resolve to this page.
Frequently asked questions
Is the TM105308 a direct drop-in for the AMAT MxP+ Metal ESC?
Yes, same OEM cathode, process kits, settings and voltages.
Which OEM part numbers does it replace?
0090-35112.
How is it different from the OEM ESC?
It replaces the polyimide design with an improved coulombic ceramic ESC for better etch/temperature uniformity and particle performance.
Why does the OEM polyimide ESC drift out of specification?
Polyimide degrades with plasma exposure and thermal cycling, so clamping and temperature uniformity change as it ages.
Can a waferless plasma clean be performed?
Yes.
What wafer sizes are available?
150mm and 200mm.
Can it be repaired, and how many times?
Up to three times, via Level 1 or Level 2 repair (indicatively ~25% and ~70% of new).
Do I need to change my process recipe?
No.
Where is it supplied?
North America, Europe, South-East Asia and Japan.
Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.
ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.