The TM105108 is a direct-equivalent ESC for the Applied Materials MxP+ oxide etch chamber, supplied by ESC Technology as a drop-in replacement for OEM part numbers 0040-99949, 0010-10327 and 0041-34688. It installs onto the existing OEM cathode and runs with the same process kits, the same ESC settings and the same voltages, so it can be qualified into a production chamber without changing the recipe or the surrounding hardware.
What the ESC does, and why its condition matters
In an oxide etch chamber the ESC does two jobs at once: it clamps the wafer flat against the cathode, and it holds the wafer at a controlled temperature throughout the process. Both jobs feed directly into process results. If clamping force is uneven or drifts, the wafer is not held flat and thermal contact varies across its surface; if temperature uniformity is lost, etch rate and profile drift with it. The ESC is therefore not a passive fixture. Its condition sets the ceiling on etch uniformity, particle performance and ultimately yield. On a high-utilisation oxide chamber, every hour the ESC is out of specification is lost throughput and scrapped wafers, which is why the ESC is one of the most closely watched consumable-life items in the chamber.
Why engineers replace the OEM MxP+ Oxide ESC
The original MxP+ ESC is a polyimide-based design. Polyimide degrades with plasma exposure and thermal cycling, and as it ages the symptoms appear in the process one after another: clamping force drifts, temperature uniformity is lost across the wafer, particle counts climb, and dechucking becomes slow or unreliable. Each of these costs throughput, scrap and unplanned downtime, and together they are the usual reason an MxP+ oxide ESC is pulled and replaced. Because the degradation is gradual, the process often drifts out of its window before the ESC is formally failed, so a more stable replacement pays back not only in ESC life but in fewer marginal wafers along the way.
The coulombic ceramic difference
The TM105108 replaces the polyimide ESC with an improved coulombic ceramic design. The change of both design and material is what delivers the gains: better etch and temperature uniformity across the wafer, improved particle performance, and clamping behaviour that stays consistent from the first wafer to the last rather than drifting as polyimide does. Because the ESC no longer depends on an ageing polyimide layer for its clamping and thermal behaviour, the process stays inside its window for far longer, and the chamber spends more of its time producing wafers in specification.
Material
ESC Technology builds the ESC from an improved ceramic body in place of the OEM polyimide construction, which is what gives the more stable clamping and thermal behaviour described above.
Process and particle performance
A waferless plasma clean can be performed with this ESC, a meaningful operational benefit, because it lets the chamber be cleaned and kept stable between wafers without the cost and handling of a dummy wafer. Combined with more uniform clamping and improved thermal contact, the result is more uniform oxide etch, lower particle counts and steadier process results across the full life of the ESC. For an engineer, the practical effect is fewer process-drift investigations and fewer particle excursions traced back to the ESC.
Drop-in compatibility and qualification
The TM105108 is designed to qualify into the existing chamber with minimal change:
- Fits the existing OEM cathode: no hardware modification.
- Uses the same OEM process kits.
- Runs the same ESC settings and voltages.
Because nothing in the surrounding chamber changes, qualification is straightforward and the ESC can be brought into production quickly, rather than requiring a recipe redevelopment or a hardware change that would extend the qualification window.
Sizes
The MxP+ Oxide ESC is available for 100mm, 150mm and 200mm wafer processing, so the same equivalent can be specified across a mixed-size install base.
Repairable to new: lower cost of ownership
The defining commercial difference between an ESC Technology ESC and the OEM part is that the TM105108 is built to be reconditioned to original specification rather than scrapped. ESC Technology offers two repair routes: a Level 1 surface recondition (typically around 25% of the price of new) and a Level 2 full strip and rebuild (typically around 70%). A single ESC can be returned to specification up to three times. Over the life of a chamber that repairability changes the economics: instead of buying a new ESC every time one fails, a fab can recondition the same equivalent ESC repeatedly at a fraction of the price of new, which is precisely what “reduce cost of ownership” means for an oxide etch chamber. (Repair pricing is indicative and quoted per ESC after inspection.)
Why source the equivalent from ESC Technology
Every ESC is built to consistent quality, supplied with the “direct equivalent, not an OEM part” position stated plainly, and backed by the repair programme above. ESC Technology supplies and supports the MxP+ Oxide equivalent across North America, Europe, South-East Asia and Japan.
Specifications
| Chamber / platform | Applied Materials MxP+ (oxide etch) |
| ESC Technology part no. | TM105108VN-D |
| Clamping type | Coulombic |
| Replaces | Polyimide OEM ESC |
| Cathode / process kit | Uses existing OEM cathode and process kits |
| Settings / voltages | Same as OEM |
| Waferless plasma clean | Supported |
| Wafer sizes | 100mm, 150mm, 200mm |
| Repairable | Yes: Level 1 & Level 2, up to 3× |
OEM cross-reference
| OEM (Applied Materials) part no. | ESC Technology equivalent |
| 0040-99949 | TM105108VN-D |
| 0010-10327 | TM105108VN-D |
| 0041-34688 | TM105108VN-D |
Applied Materials periodically revises part numbers; both superseded and current numbers for this ESC resolve to this page.
Frequently asked questions
Is the TM105108 a direct drop-in for the AMAT MxP+ Oxide ESC?
Yes. It fits the existing OEM cathode and uses the same process kits, settings and voltages, so no chamber hardware or recipe change is required.
Which OEM part numbers does it replace?
0040-99949, 0010-10327 and 0041-34688.
How is it different from the OEM ESC?
The OEM ESC is a polyimide design; the TM105108 is an improved coulombic ceramic ESC that gives better etch and temperature uniformity and improved particle performance, with clamping that does not drift as polyimide ages.
Why does the OEM polyimide ESC drift out of specification?
Polyimide degrades with plasma exposure and thermal cycling, so clamping force and temperature uniformity change as the ESC ages, which is what pushes the process out of its window.
Can a waferless plasma clean be performed?
Yes, the ESC supports a waferless plasma clean.
What wafer sizes are available?
100mm, 150mm and 200mm.
Can the ESC be repaired, and how many times?
Yes, up to three times, via Level 1 (surface recondition) or Level 2 (full rebuild). Pricing is indicative at around 25% and 70% of new respectively.
Do I need to change my process recipe?
No. It runs the same settings and voltages as the OEM ESC.
Where does ESC Technology supply this ESC?
Across North America, Europe, South-East Asia and Japan.
Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.
ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.