The TM105708 is a direct-equivalent ESC for the Applied Materials Super-E etch chamber, manufactured and supplied by ESC Technology as a drop-in replacement for OEM part numbers 0040-39990, 0010-05966 and 0190-81399. It installs onto the existing OEM cathode and runs with the same process kits, settings and voltages, so it can be qualified into a production chamber without changing the recipe or the surrounding hardware.
What the Super-E ESC does
In an etch chamber the ESC clamps the wafer to the cathode and holds it at a controlled temperature throughout the process. Clamping stability and thermal uniformity drive etch uniformity, particle performance and ultimately yield, so the condition of the ESC has a direct effect on the cost and quality of every wafer the chamber runs. The Super-E ESC sits at the centre of the Applied Materials Super-E etch platform, and when it starts to fail the whole chamber’s output suffers with it.
Why engineers replace the OEM Super-E ESC
The original Super-E ESC is an aluminium-nitride (AlN) plate that clamps using the Johnsen-Rahbek (JR) effect. JR clamping relies on a small leakage current across the contact between the ESC surface and the wafer, which means the clamping force depends on the surface condition of the plate. As the plate ages and its surface changes, that force drifts, and the symptoms are familiar to anyone running these chambers: wafers that stick at the end of the process, inconsistent or failed dechucking, particle excursions, and a gradual loss of temperature uniformity. On the OEM plate design, sidewall etching also develops over time. Each of these costs throughput, scrap and unplanned downtime, and together they are the usual reason a Super-E ESC is pulled and replaced.
A coulombic CP ESC: the engineering difference
The TM105708 replaces the AlN JR plate with a coulombic ESC built from ESC Technology’s proprietary Super Dense CP (Ceramic Plate) material. A coulombic ESC clamps through direct electrostatic attraction rather than the Johnsen-Rahbek leakage mechanism, so clamping force does not depend on the surface condition of the plate. That single change is what removes the sticking and dechucking problems that develop on an ageing JR ESC: the clamp behaves consistently from the first wafer to the last, and dechucking is clean and repeatable. Because the design no longer relies on the OEM plate geometry, it also eliminates the sidewall etching seen with the original ESC.
The Super Dense CP material
The Super Dense CP ceramic body is denser than the OEM AlN plate. The higher density supports a higher dielectric breakdown voltage and improves heat conduction through the ESC, which translates into tighter temperature control across the wafer and a longer service interval before repair is needed.
Process and particle performance
More uniform clamping, combined with improved thermal contact, gives more uniform etch and better particle performance than a worn OEM ESC. For high-volume chambers the practical effect is steadier process results across the full life of the ESC and fewer interruptions for dechuck faults or particle excursions, which is where the ESC pays back in yield and uptime rather than just purchase price.
Drop-in compatibility and qualification
The TM105708 is designed to qualify into an existing chamber with minimal change:
- Fits the existing OEM cathode: no hardware modification.
- Uses the same OEM process kits.
- Runs the same ESC settings and voltages.
Because nothing in the surrounding chamber changes, qualification is straightforward and the ESC can be brought into production quickly.
Sizes and variants
The Super-E ESC is available for 150mm and 200mm wafer processing. Two build references are offered, TM105708VN-D and the CP build TM105708VN-CP.
Repairable to new: lower cost of ownership
The defining commercial difference between an ESC Technology ESC and the OEM part is that the TM105708 is built to be repaired rather than scrapped. ESC Technology offers two repair routes:
- Level 1: surface recondition, typically around 25% of the price of a new ESC.
- Level 2: full strip and rebuild to original specification, typically around 70%.
A single ESC can be returned to specification up to three times. Over the life of a chamber that repairability changes the economics entirely: instead of buying a new OEM ESC every time one fails, a fab can recondition the same equivalent ESC repeatedly at a fraction of the cost. That is what “reduce cost of ownership” means in practice for a Super-E chamber. (Repair pricing is indicative and quoted per ESC after inspection.)
Supply and support
ESC Technology supplies and supports the Super-E equivalent across North America, Europe, South-East Asia and Japan.
Specifications
| Chamber / platform | Applied Materials Super-E (etch) |
| ESC Technology part no. | TM105708VN-D (CP build: TM105708VN-CP) |
| Clamping type | Coulombic |
| Plate material | Super Dense CP (Ceramic Plate) |
| Replaces | AlN, JR-type OEM ESC |
| Cathode / process kit | Uses existing OEM cathode and process kits |
| Wafer sizes | 150mm, 200mm |
| Repairable | Yes: Level 1 & Level 2, up to 3× |
OEM cross-reference
| OEM (Applied Materials) part no. | ESC Technology equivalent |
| 0040-39990 | TM105708VN-D |
| 0010-05966 | TM105708VN-D |
| 0190-81399 | TM105708VN-D |
Applied Materials periodically revises part numbers; both superseded and current numbers for this ESC resolve to this page.
Frequently asked questions
Is the TM105708 a direct drop-in for the AMAT Super-E ESC?
Yes. It fits the existing OEM cathode and uses the same process kits, settings and voltages, so no chamber hardware or recipe change is required.
Do I need to change my process recipe, cathode or process kits?
No. The ESC is designed to run on the existing OEM cathode and process kits with the same settings and voltages, which keeps qualification simple.
What is the difference between a coulombic ESC and the OEM JR ESC?
The OEM ESC uses Johnsen-Rahbek clamping, which depends on the plate’s surface condition and drifts as the plate ages. The TM105708 is a coulombic ESC, so clamping force stays consistent and dechucking remains clean over the ESC’s life.
Why does the OEM Super-E ESC develop sticking and dechucking problems?
Because JR clamping force changes with the surface condition of the AlN plate. As that surface degrades, dechucking becomes unreliable and wafers stick, a failure mode the coulombic design avoids.
What is Super Dense CP material and why does it matter?
It is ESC Technology’s proprietary high-density ceramic plate material. Its higher density supports a higher breakdown voltage and better heat conduction, giving tighter temperature control and longer life than the OEM AlN plate.
Can the Super-E ESC be repaired, and how many times?
Yes, up to three times, via Level 1 (surface recondition) or Level 2 (full rebuild to original specification).
How much does a repair cost compared with a new ESC?
Indicatively, a Level 1 recondition is around 25% of the price of new and a Level 2 rebuild around 70%. Final pricing is quoted per ESC after inspection.
Which OEM part numbers does the TM105708 replace?
0040-39990, 0010-05966 and 0190-81399.
What wafer sizes are available?
150mm and 200mm.
Where does ESC Technology supply the Super-E equivalent?
Across North America, Europe, South-East Asia and Japan.
Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.
ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.