The TM106208 is a direct-equivalent ESC for the Applied Materials WEB / TEB chamber, supplied by ESC Technology as a drop-in replacement for OEM part numbers 0040-99998. It installs onto the existing OEM cathode and runs with the same process kits, settings and voltages, so it qualifies into a production chamber without a recipe change.
What the ESC does, and why its condition matters
In the WEB / TEB chamber the ESC clamps the wafer flat against the cathode and holds its temperature through the process. Clamping stability and thermal uniformity drive etch uniformity and particle performance, so the ESC’s condition sets the ceiling on yield. A worn ESC caps uniformity and particle performance quietly, before it is ever formally failed, so ESC stability matters for steady production as much as for avoiding hard failures.
Why engineers replace the OEM WEB / TEB ESC
The OEM ESC is a polyimide design. As the polyimide ages under plasma exposure and thermal cycling, clamping force drifts, temperature uniformity is lost, particle counts climb and dechucking becomes unreliable, the failure pattern that forces a WEB / TEB ESC replacement. Because the drift is gradual, the chamber often produces marginal wafers before the ESC is changed.
The coulombic ceramic difference
The TM106208 replaces the polyimide ESC with an improved coulombic ceramic design. Better design and material give better etch and temperature uniformity and improved particle performance, with consistent clamping across the ESC’s life, so the chamber holds its process window for longer and produces more in-specification wafers between interventions.
Material
An improved ceramic body in place of the OEM polyimide construction, underpinning the more stable clamping and thermal behaviour.
Process and particle performance
A waferless plasma clean can be performed with this ESC, letting the chamber be cleaned and kept stable between wafers without a dummy wafer. With more uniform clamping and improved thermal contact, WEB / TEB etch uniformity and particle performance improve and stay stable over a longer service interval.
Drop-in compatibility and qualification
- Fits the existing OEM cathode: no hardware modification.
- Uses the same OEM process kits.
- Runs the same ESC settings and voltages.
Sizes
Available for 150mm and 200mm wafer processing.
Repairable to new: lower cost of ownership
Built to be reconditioned to original specification rather than scrapped. Level 1 (~25% of new) and Level 2 (~70%) repair routes are available, up to three times per ESC, reducing lifetime cost of ownership versus repeated OEM purchases and turning each ESC into a reusable asset. (Repair pricing is indicative and quoted per ESC after inspection.)
Why source the equivalent from ESC Technology
Consistent build quality, a clear “direct equivalent, not an OEM part” position, and the repair programme above, supported across North America, Europe, South-East Asia and Japan.
Keeping the WEB / TEB process stable
Process stability on the WEB / TEB chamber comes down to how consistently the ESC clamps and how well it holds wafer temperature across a long production campaign. The OEM polyimide ESC erodes both as it ages: clamping force drifts, the wafer is held progressively less flat, thermal contact becomes uneven, and particle counts climb, so the process tends to wander out of its window between scheduled cleans, and engineers spend time chasing drift that traces back to the ESC. The coulombic ceramic TM106208 removes that drift at source by holding clamping force steady independent of surface ageing, so the wafer stays flat and thermally well-coupled across the campaign. The result is fewer mid-campaign process-drift investigations, fewer ESC-related particle excursions, and a more predictable maintenance interval. Because the ESC supports a waferless plasma clean, the chamber can also be kept clean and stable between wafers without the cost and handling of a dummy wafer. And since the equivalent runs the same settings and voltages on the existing cathode and process kits, that added stability is gained as a drop-in, with the qualified recipe unchanged.
Specifications
| Chamber / platform | Applied Materials WEB / TEB |
| ESC Technology part no. | TM106208VN-D |
| Clamping type | Coulombic |
| Replaces | Polyimide OEM ESC |
| Cathode / process kit | Uses existing OEM cathode and process kits |
| Settings / voltages | Same as OEM |
| Waferless plasma clean | Supported |
| Wafer sizes | 150mm, 200mm |
| Repairable | Yes: Level 1 & Level 2, up to 3× |
OEM cross-reference
| OEM (Applied Materials) part no. | ESC Technology equivalent |
| 0040-99998 | TM106208VN-D |
Applied Materials periodically revises part numbers; both superseded and current numbers resolve to this page.
Frequently asked questions
Is the TM106208 a direct drop-in for the AMAT WEB / TEB ESC?
Yes, same OEM cathode, process kits, settings and voltages, so no recipe change is required.
Which OEM part numbers does it replace?
0040-99998.
How is it different from the OEM ESC?
It replaces the polyimide design with an improved coulombic ceramic ESC for better etch/temperature uniformity and particle performance.
Why does the OEM polyimide ESC drift out of specification?
Polyimide degrades with plasma exposure and thermal cycling, so clamping and temperature uniformity change as it ages.
Can a waferless plasma clean be performed?
Yes.
What wafer sizes are available?
150mm and 200mm.
Can it be repaired, and how many times?
Up to three times, via Level 1 or Level 2 repair (indicatively ~25% and ~70% of new).
Do I need to change my process recipe?
No.
Where is it supplied?
North America, Europe, South-East Asia and Japan.
Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.
ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.