Our ESC’s are used by global fabs in AMAT chambers, including 200 and 300mm Ultima HDPCVD and DPS2 Etch.
These are completely new ESC’s built by us, using the same materials and design as the OEM ESC, so qualification and interchange is easy.
We repair our own ESC’s back to new condition several times, reducing your cost of ownership and securing your supply chain
Why electrostatic chuck CTE and wafer matching matter: alumina, AlN and silicon expansion, differential stress, particles and thermal uniformity.
How electrostatic chuck volume resistivity sets the Coulombic or Johnsen-Rahbek clamping regime, the resistivity bands, and why it matters in the fab.
Ceramic vs polymer electrostatic chucks compared on plasma resistance, thermal tolerance and durability, and where each type is actually used.
How titania-doped alumina tunes electrostatic chuck resistivity into the Johnsen-Rahbek band for higher clamping force per volt, and the trade-offs involved.
Aluminum nitride (AlN) electrostatic chucks: high thermal conductivity, CTE close to silicon, JR clamping and where the cost premium over alumina pays off.
