As part of our expansion with TEMNEST, a new company has opened in the USA.
ESCT Inc will better serve our growing North American user base and partner network.
ESCT Inc is a wholly owned subsidiary of ESCT Limited and delivers local commercial and technical support to our customers and partners. You can reach us through all usual channels or directly at the numbers and addresses shown on our contact us page.
Why electrostatic chuck CTE and wafer matching matter: alumina, AlN and silicon expansion, differential stress, particles and thermal uniformity.
How electrostatic chuck volume resistivity sets the Coulombic or Johnsen-Rahbek clamping regime, the resistivity bands, and why it matters in the fab.
Ceramic vs polymer electrostatic chucks compared on plasma resistance, thermal tolerance and durability, and where each type is actually used.
How titania-doped alumina tunes electrostatic chuck resistivity into the Johnsen-Rahbek band for higher clamping force per volt, and the trade-offs involved.
Aluminum nitride (AlN) electrostatic chucks: high thermal conductivity, CTE close to silicon, JR clamping and where the cost premium over alumina pays off.
