ESC Technology is continuing to grow globally and we are delighted to Welcome Greg Sajbel onto the team. Greg is an industry veteran with many years experience in front-end equipment and business development. He will be responsible for our growing business with USA Wafer Fabs and equipment OEMs, and ensuring that or products and services meet and exceed our expectations.
You can reach Greg by email at greg@esctech.com
Why electrostatic chuck CTE and wafer matching matter: alumina, AlN and silicon expansion, differential stress, particles and thermal uniformity.
How electrostatic chuck volume resistivity sets the Coulombic or Johnsen-Rahbek clamping regime, the resistivity bands, and why it matters in the fab.
Ceramic vs polymer electrostatic chucks compared on plasma resistance, thermal tolerance and durability, and where each type is actually used.
How titania-doped alumina tunes electrostatic chuck resistivity into the Johnsen-Rahbek band for higher clamping force per volt, and the trade-offs involved.
Aluminum nitride (AlN) electrostatic chucks: high thermal conductivity, CTE close to silicon, JR clamping and where the cost premium over alumina pays off.
