Increased Throughput, Lam Exelan 4520 ESC – TM207108

Electrostatic chuck, angled top view

The latest 300mm ESC technology is used to create improved ESC’s at 200mm, 150mm and even 100mm by ESCT. The proprietary Super Dense CP process for advanced 300mm ESC’s is being used to create another new set of alternative ESC’s at 200mm for AMAT, Lam, TEL and SPTS chambers. 

Our new ESC TM207108 replaces OEM ESC’s including 839-440462-508, 839,440462-108 for Lam Exelan or 4520 chambers. TM207108 delivers performance and cost advantages over 839-440462-508, 839,440462-108 and simplifies the wafer dechucking process, saving up to 30 seconds per etch and increasing overall throughput.

Constructed from proprietary Super Dense alumina (Al₂O₃),  TM207108 offers improved reliability and lifetime compared to the OEM ESC. It also removes the need for perimeter lift pins mechanisms and prevents wafer sticking. Additionally, the ESC can be refurbished multiple times back to new condition, extending lifetime and lowering total cost of ownership.

TM207108 is fully compatible with OEM power supplies and process kits, enabling seamless hardware integration with reduced maintenance and operational costs. 

Electrostatic chuck, angled top view
Exelan etch process recipe comparison table

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