A critical part for any ESC and chamber are lift pins which pick the wafer up for the robot and place back on the ESC.
ESCT now supplies new high quality 2nd Source lift pins for AMAT DPS Chambers.
We offer both metal and ceramic options which are needed for waferless chamber plasma cleans.
These are OEM equivalent to 0010-36202 & 0010-23726 AMAT P/N.
Contact us here for more information.
Why electrostatic chuck CTE and wafer matching matter: alumina, AlN and silicon expansion, differential stress, particles and thermal uniformity.
How electrostatic chuck volume resistivity sets the Coulombic or Johnsen-Rahbek clamping regime, the resistivity bands, and why it matters in the fab.
Ceramic vs polymer electrostatic chucks compared on plasma resistance, thermal tolerance and durability, and where each type is actually used.
How titania-doped alumina tunes electrostatic chuck resistivity into the Johnsen-Rahbek band for higher clamping force per volt, and the trade-offs involved.
Aluminum nitride (AlN) electrostatic chucks: high thermal conductivity, CTE close to silicon, JR clamping and where the cost premium over alumina pays off.
