New Business Group Now Open – ESCT Fab Support

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ESCT is pleased to announce the launch of a new business division – Fab Support.

ESCT Fab Support is aimed at further supporting our existing customers with additional critical, proven products for sustaining or upgrading fab equipment are supplied.

We are working hard to get a new affiliated site up and running with our new range of products, repairs and upgrades. In the meantime, please – get in touch for our products and forward any questions to us!

MORE NEWS

Coefficient of Thermal Expansion & Wafer Matching in ESCs

Why electrostatic chuck CTE and wafer matching matter: alumina, AlN and silicon expansion, differential stress, particles and thermal uniformity.

Volume Resistivity & the ESC Clamping Regime

How electrostatic chuck volume resistivity sets the Coulombic or Johnsen-Rahbek clamping regime, the resistivity bands, and why it matters in the fab.

Ceramic vs Polymer ESCs

Ceramic vs polymer electrostatic chucks compared on plasma resistance, thermal tolerance and durability, and where each type is actually used.

Titania-Doped Alumina ESCs: Tuning Resistivity

How titania-doped alumina tunes electrostatic chuck resistivity into the Johnsen-Rahbek band for higher clamping force per volt, and the trade-offs involved.

Aluminum Nitride (AlN) ESCs: Properties & Use

Aluminum nitride (AlN) electrostatic chucks: high thermal conductivity, CTE close to silicon, JR clamping and where the cost premium over alumina pays off.