The improved performance is attributed to its aluminium oxide (Al₂O₃) construction and non-stick surface, which reduce particle generation and enhance process stability. Unlike conventional OEM designs, the TM106208 supports periodic plasma cleaning without the need for dummy wafers, further extending the interval between cleans and lowering consumable usage.
Fully compatible with existing cathodes, power supplies, and process kits, the TM106208 requires no recipe changes, allowing for integration. Its ability to be refurbished multiple times also contributes to a lower total cost of ownership, making it an attractive solution for semiconductor manufacturers focused on improving uptime and efficiency.
