DPS + Metal ESC – Direct Equivalent to 0010-15452

DPS + Metal TM105608N ESC, top view DPS + Metal TM105608N ESC, bottom view
DPS + Metal ESC – Direct Equivalent to 0010-15452

Direct equivalent to P/N – (0010-15452 – 0195-077994)

The latest CESC technology for AMAT DPS+ Metal Etch and Poly Etch chambers.

Our ESC TM105608 replaces the OEM AlN ESC and improves cost of ownership and process performance.

TM105608 uses the same OEM cathode and process kit and can be repaired to new condition multiple times. Our improved coulombic design and better material means no sticking and much longer lifetime.

Now available for 150mm, 200mm

OEM P/N

0010-15452 – 0195-077994

ESCS P/N

N/A

SOURCE

N/A
Available wafer sizes200mm150mm

The TM105608 is the latest ceramic ESC (CESC) technology for the Applied Materials DPS+ metal etch and poly etch chambers, supplied by ESC Technology as a direct-equivalent, drop-in replacement for OEM part numbers 0010-15452 and 0195-077994. It uses the same OEM cathode and process kit, and can be repaired to new condition multiple times.

What the ESC does, and why its condition matters

In the DPS+ metal etch chamber the ESC clamps the wafer flat against the cathode and controls its temperature through the process. Metal etch is demanding on particle performance and temperature uniformity: metal residues and particle defects are unforgiving on yield, so the ESC’s condition has a direct bearing on etch quality and yield. A degraded ESC caps performance well before it is formally failed.

Why engineers replace the OEM DPS+ Metal ESC

The original ESC is an aluminium-nitride (AlN) plate. As it ages, its clamping and surface condition change, bringing wafer sticking, unreliable dechucking, particle excursions and loss of temperature uniformity, the failure pattern that takes a DPS+ metal chamber out of spec. The surface-condition cause means the problems worsen progressively rather than appearing all at once.

The coulombic CESC difference

The TM105608 replaces the OEM AlN ESC with ESC Technology’s latest CESC technology and an improved coulombic design. The improved design and better material mean no sticking and a much longer lifetime, with consistent clamping and clean dechucking across the ESC’s service life, a stable baseline rather than a moving target.

Material

ESC Technology’s improved ceramic material in place of the OEM AlN plate, which removes the surface-condition dependence and extends life.

Process and particle performance

More consistent clamping and improved thermal contact give steadier metal etch results and better particle performance than a worn AlN ESC, and hold that performance over a longer service interval, fewer particle excursions and a more predictable process window.

Drop-in compatibility and qualification

  • Fits the existing OEM cathode: no hardware modification.
  • Uses the same OEM process kit.

Sizes

Available for 150mm and 200mm wafer processing.

Repairable to new: lower cost of ownership

The TM105608 can be repaired to new condition multiple times. Level 1 (~25% of new) and Level 2 (~70%) repair routes are available, up to three times per ESC, which is what “reduce cost of ownership” means in practice for a DPS+ metal chamber, replacing repeated new-ESC purchases with low-cost reconditioning. (Repair pricing is indicative and quoted per ESC after inspection.)

Why source the equivalent from ESC Technology

Consistent build quality, a clear “direct equivalent, not an OEM part” position, and the repair programme above, supported across North America, Europe, South-East Asia and Japan.

Lifetime and durability in DPS+ metal etch

Metal etch is hard on ESCs, so lifetime and durability are central to the cost case for the DPS+ metal equivalent. The OEM aluminium-nitride ESC drifts as its surface is conditioned by the plasma, which brings the familiar sticking and dechucking problems. It also reaches end of life and is scrapped, so each failure is a full replacement cost. The CESC coulombic TM105608 changes both halves of that equation. First, decoupling clamping from surface condition removes the progressive sticking and dechuck failures, so the ESC holds a stable baseline for much longer in a demanding metal-etch duty cycle. Second, the ESC is built to be reconditioned to new condition rather than scrapped, so the same ESC can serve several service lives through Level 1 and Level 2 repair. For a high-utilisation DPS+ metal chamber, the combination means fewer interruptions for ESC-related particle excursions and a materially lower cost per wafer over the life of the tool. Keeping one reconditioned ESC in rotation lets a tired ESC be pulled and repaired while the spare runs, so ESC maintenance never gates the chamber’s availability.

Specifications

Chamber / platform Applied Materials DPS+ (metal & poly etch)
ESC Technology part no. TM105608N
Technology Latest CESC, coulombic
Replaces AlN OEM ESC
Cathode / process kit Uses existing OEM cathode and process kit
Wafer sizes 150mm, 200mm
Repairable Yes: to new condition, multiple times (L1 & L2)

OEM cross-reference

OEM (Applied Materials) part no. ESC Technology equivalent
0010-15452 TM105608N
0195-077994 TM105608N

Applied Materials periodically revises part numbers; superseded and current numbers resolve to this page.

Frequently asked questions

Is the TM105608 a direct drop-in for the AMAT DPS+ Metal ESC?

Yes, it uses the same OEM cathode and process kit, replacing OEM 0010-15452 and 0195-077994.

Does it also serve DPS+ poly etch?

Yes, it is the latest CESC technology for both DPS+ metal and poly etch chambers.

How is it different from the OEM DPS+ ESC?

The OEM ESC is an AlN plate; the TM105608 is the latest CESC coulombic ceramic ESC, no sticking and a much longer lifetime.

Why does the OEM AlN ESC develop sticking and dechucking problems?

Because the clamping behaviour of an AlN ESC changes with surface condition as it ages.

Which OEM part numbers does it replace?

0010-15452 and 0195-077994.

What wafer sizes are available?

150mm and 200mm.

Can it be repaired, and how many times?

Yes, to new condition, up to three times, via Level 1 or Level 2 repair (indicatively ~25% and ~70% of new).

Where is it supplied?

North America, Europe, South-East Asia and Japan.

Reducing chamber maintenance in DPS+ metal etch

Metal etch chambers accumulate residues quickly, and an unstable ESC makes that worse: as clamping and thermal contact drift, deposition and particle behaviour become less predictable and the chamber needs more frequent intervention. A coulombic CESC ESC that holds its clamping baseline across its service life keeps wafer temperature and contact consistent, which helps the chamber hold a predictable clean and maintenance interval rather than drifting between scheduled wet cleans. Combined with the ESC’s own repairability, that stability reduces both the frequency of ESC-driven interventions and the total maintenance burden on a high-utilisation DPS+ metal tool.

Request a quotation: send us your OEM part number or chamber and we’ll confirm the equivalent and lead time.

ESC Technology is an independent supplier and is not affiliated with, authorised by, or endorsed by Applied Materials. This product is a direct equivalent only. It is not an OEM part.


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